axs6 169 sop ic sockets (axs6) ?ocket series ic sockets for small outline package features 1. requires no pattern changes when directly mounting an ic the foot patterns of so package ic chips and of the socket are identical. thus, the sockets can be used from prototyping to initial production, and during actual production the ic chips can be directly mounted to the pc board without any changes to the pc board patterns. 2. achieves a mounting height of 5mm or less including the ic s height the maximum height is 5mm, even when taking into consideration the rise in cream solder and the ic s maximum height. ideal for low-pro?e requirements. socket height: 4.5mm (28, 32 and 40 contact) socket height: 4.2mm (8, 20 and 24 contact) 3. space saving the socket occupies an area only 1.25 times the size of the ic. high density mounting is possible even if the socket is used. 4. automated mounting compatible the socket has an open ?t construction on its top surface so that it can be picked up by an automated mounting machine using suction for automated mounting. applications 1. for initial production (prototyping to initial production stages, which use sockets for fast production of a new product) 2. for functional upgrades (situations requiring rom replacement or lsi chip replacement) socket frame so package ic chip socket body vendor-classified compatibility list for sop ic sockets please consult us for compatibility with other ic models. notes) 1. the centering frame is used to secure ics which are too small to be secured with the standard frame. the centering fram e has inward projections in the center portion. for easy identi cation, the centering frame is a sky gray color, whereas the standard frame is a creamy gray color. 2. the contents of this compatibility list are valid as of july, 2002. no. of contacts nominal dimensions applicable ics (ic maker: part no.) 8 300 mil fujitsu: fpt-8p-m01 ti: ps008 14 300 mil nec: p14gm-50-300b-2 mitsubishi: 14p2w toshiba: sop14-p-300 ti: ps014 hitachi: fp-14d, fp-14da fujitsu: fpt-14p-m04 motorola: 751a-02 20 300 mil nec: p20gm-50-300b, p20gm-50-300c-2 mec: sonf-20d hitachi: fp-20da, fp-20dn 375 mil nec: p20gm-50-375b-3, p20gt-50-375b-2 motorola: 751d-03 fujitsu: fpt-20p-m02 atmel: 20s 24 300 mil nec: p24gm-50-300b-2 28 375 mil nec: p28gm-50-375b-2, p28gt-50-375b-2 mitsubishi: 28p2v-a fujitsu: fpt-28p-m01 motorola: 751f-02 450 mil standard frame toshiba: sop28-p-450 oki ic: sop28-p-430-k atmel: 28r centering frame nec: p28gm-50-450a1-2, p28gm-50-450a2-2 hitachi: fp-28d, fp-28da mitsubishi: 28p2w-a, 28p2w-c mec: sop028-p-0425 sharp: sop28-p-450 32 450 mil fujitsu: fpt-32p-m02 toshiba: sop32-p-450 525 mil nec: s32gm-50-525a-2 mitsubishi: 32p2m-a toshiba: sop32-p-525 macronix: mx27c1000mc-90 hitachi: fp-32d fujitsu: fpt-32p-m03 sanyo: 3205 40 525 mil hitachi: fp-40d mitsubishi: 40p2m-a 44 600 mil nec: p44gx-50-600a intel: 231369-80 axs6.fm 169 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 170 product types mounted on a pcb, these sockets are constructed with the ic placed on the socket and secured with a frame. accordingly, when placing your order, please order the socket and frame as a set. sop ic sockets, which require strict dimensional accuracy for smd terminals, should be ordered in units of single packages to prevent terminal damage during transit. 1. small lot, 5-set pack (standard) quantities when ordering if you order, for example, ve of axs608609c , one pack will be delivered (with ve sockets and 5 frames). socket frame socket body ?pack package containing 5 pieces (standard) ?stick package (standard) ?frame note) the centering frame is used to secure small ic chips which cannot be secured with the standard frame (it has projections i n the center). the standard frame is colored creamy gray and the centering frame is colored sky gray for easy identi cation. no. of contacts nominal dimension part no. packing quantity pack outer carton 8 300 mil (7.62mm) axs608309c socket: 5 pcs. frame: 5 pcs. socket: 500 pcs. frame: 500 pcs. (100 packs) 14 300 mil (7.62mm) axs614309c 20 300 mil (7.62mm) axs620309c 375 mil (9.53mm) axs620319c 24 300 mil (7.62mm) axs624309c 28 standard frame 375 mil (9.53mm) axs628319c 450 mil (11.43mm) axs628329c centering frame 450 mil (11.43mm) axs628c329c 32 450 mil (11.43mm) axs632329c 525 mil (13.34mm) axs632339c 40 525 mil (13.34mm) axs640339c 44 600 mil (15.24mm) axs644349c no. of contacts nominal dimension part no. packing quantity stick outer carton 8 300 mil (7.62mm) axs608309s 50 pcs. 300 pcs. 14 300 mil (7.62mm) axs614309s 25 pcs. 300 pcs. 20 300 mil (7.62mm) axs620309s 25 pcs. 300 pcs. 375 mil (9.53mm) axs620319s 25 pcs. 300 pcs. 24 300 mil (7.62mm) axs624309s 25 pcs. 300 pcs. 28 standard frame 375 mil (9.53mm) axs628319s 20 pcs. 300 pcs. 450 mil (11.43mm) axs628329s 20 pcs. 300 pcs. centering frame 450 mil (11.43mm) axs628c329s 20 pcs. 300 pcs. 32 450 mil (11.43mm) axs632329s 20 pcs. 300 pcs. 525 mil (13.34mm) axs632339s 20 pcs. 300 pcs. 40 525 mil (13.34mm) axs640339s 15 pcs. 300 pcs. 44 600 mil (15.24mm) axs644349s 15 pcs. 300 pcs. no. of contacts nominal dimension stick package vinyl bag part no. packing quantity part no. packing quantity stick outer carton vinyl package outer carton 8 300 mil (7.62mm) axs60820 50 pcs. 300 pcs. axs60820v 500 pcs. 2,000 pcs. 14 300 mil (7.62mm) axs61420 25 pcs. 300 pcs. axs61420v 500 pcs. 2,000 pcs. 20 300 mil (7.62mm) axs62020 25 pcs. 300 pcs. axs62020v 500 pcs. 2,000 pcs. 375 mil (9.53mm) AXS62021 25 pcs. 300 pcs. AXS62021v 500 pcs. 2,000 pcs. 24 300 mil (7.62mm) axs62420 25 pcs. 300 pcs. axs62420v 500 pcs. 2,000 pcs. 28 standard frame 375 mil (9.53mm) axs62821 25 pcs. 300 pcs. axs62821v 500 pcs. 2,000 pcs. 450 mil (11.43mm) axs62822 20 pcs. 300 pcs. axs62822v 500 pcs. 2,000 pcs. centering frame 450 mil (11.43mm) axs628c22 20 pcs. 300 pcs. axs628c22v 500 pcs. 2,000 pcs. 32 450 mil (11.43mm) axs63222 25 pcs. 300 pcs. axs63222v 500 pcs. 2,000 pcs. 525 mil (13.34mm) axs63223 20 pcs. 300 pcs. axs63223v 500 pcs. 2,000 pcs. 40 525 mil (13.34mm) axs64023 15 pcs. 300 pcs. axs64023v 500 pcs. 2,000 pcs. 44 600 mil (15.24mm) axs64424 15 pcs. 300 pcs. axs64424v 500 pcs. 2,000 pcs. axs6.fm 170 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 171 specifications 1. characteristics 2. materials and surface treatment item sepci cations conditions electrical characteristics rated current 0.5a insulation resistance min. 1,000m ? using 500v dc megger breakdown voltage 500v ac for 1 minute detection current: 1ma contact resistance max. 30m ? measured based on the hp4338b measurement method of jis c 5402. does not include conductor resistance of ic leads. mechanical characteristics shock resistance 981m/s 2 {100g} no interruption of current longer than 1 s environmental characteristics h 2 s after test, contact resistance max. 30m ? after 48 hours of exposure to humidity 75 to 80% r.h., temperature 40 c 2 c, concentration 3 1ppm so 2 after test, contact resistance max. 30m ? after 48 hours of exposure to humidity 90 to 95% r.h., temperature 40 c 2 c, concentration 10 3ppm humidity after test, contact resistance max. 30m ? , insulation resistance min. 100m ? after 96 hours of exposure to humidity 90 to 95% r.h., temperature 40 c 2 c thermal shock resistance after test, contact resistance max. 30m ? , insulation resistance min. 100m ? after 5 cycles where 1 cycle consists of steps 1 to 4 operating temperature 55 c to +85 c no freezing at low temperatures soldering heat resistance peak temperature of 245 c infrared re ow soldering soldering heat resistance 300 c within 5 seconds soldering iron suitable ic package (see page 169.) 8, 14, 20, 24 contacts: so package ic with nominal dimension 300 mil and 1.27mm pitch 20, 28 contacts: so package ic with nominal dimension 375 mil and 1.27mm pitch 28, 32 contacts: so package ic with nominal dimension 450 mil and 1.27mm pitch 32, 40 contacts: so package ic with nominal dimension 525 mil and 1.27mm pitch 44 contacts: so package ic with nominal dimension 600 mil and 1.27mm pitch part name material surface treatment molded portion body glass reinforced pps (ul94v-0) frame glass reinforced pps (ul94v-0) contact copper alloy contact portion: sn plating over ni, terminal portion: sn plating over ni (except for top of the terminal) sequence temperature ( c) time (minutes) 1 55 30 2 25 max. 5 385 30 4 25 max. 5 + 0 ? 3 + 10 ? 5 + 3 ? 0 + 10 ? 5 axs6.fm 171 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 172 mm general tolerance: 0.3 dimensions socket body nominal dimension: 300 mil (7.62mm) 8, 14, 20 and 24 contacts recommended pc board pattern (top view) b 1.52 1.27 0 +0.1 9.4 max.6.0 0 +0.1 0.76 0.05 dimension table (mm) no. of contacts a b 8 9.15 3.81 14 12.96 7.62 20 16.77 11.43 24 19.31 13.97 nominal dimension: 375 mil (9.53mm) 20 and 28 contacts recommended pc board pattern (top view) 1.52 b 1.27 0 +0.1 0.76 0 +0.1 11.84 max.8.5 0.05 dimension table (mm) no. of contacts a b 20 16.77 11.43 28 21.85 16.51 nominal dimension: 450 mil (11.43mm) 28 and 32 contacts recommended pc board pattern (top view) b d max.9.7 1.52 1.27 0 +0.1 0.76 0.05 dimension table (mm) no. of contacts a b c d e f 28 21.85 16.51 12.70 13.10 11.02 3.65 32 24.39 19.05 12.89 13.30 11.25 3.90 axs6.fm 172 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 173 mm general tolerance: 0.3 nominal dimension: 525 mil (13.34mm) 32 contacts recommended pc board pattern (top view) 1.52 0 +0.1 15.2 max.11.6 1.27 19.05 0 +0.1 0.76 0.1 0.05 nominal dimension: 525 mil (13.34mm) 40 contacts recommended pc board pattern (top view) 0 +0.1 15.2 max.11.6 1.52 24.13 0 +0.1 0.76 1.27 0.1 0.05 nominal dimension: 600 mil (15.24mm) 44 contacts recommended pc board pattern (top view) 1.52 0 +0.1 17.9 max.13.9 0 +0.1 0.76 1.27 26.67 0.1 0.05 axs6.fm 173 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 174 mm general tolerance: 0.3 ic chip and frame mounted on socket body a b c ic dimension table (mm) note) the 28 contacts centering frame is the same as the 28 contacts 450mil type on the above table. no. of contacts nominal dimension abc 8 300mil (7.62mm) 9.95 9.02 4.2 14 300mil (7.62mm) 13.76 9.02 4.2 20 300mil (7.62mm) 17.57 9.02 4.2 375mil (9.53mm) 17.87 12.16 4.3 24 300mil (7.62mm) 20.11 9.02 4.2 28 375mil (9.53mm) 22.95 12.16 4.5 450mil (11.43mm) 22.65 12.83 4.15 32 450mil (11.43mm) 25.49 13.92 4.58 525mil (13.34mm) 25.19 15.54 4.5 40 525mil (13.34mm) 32.22 17.00 4.5 44 600mil (15.24mm) 34.76 19.20 4.7 mm embossed tape and reel ?tape dimensions (conforming to jis c 0806-1995) ?reel dimensions (conforming to jis c 0806-1995) 1.75 c d a 0.3 4 2 pull-out direction b 1.5 dia. +0.1 0 f e +2 0 top cover tape embossed carrier tape dimension table (mm) notes) 1. the above table only describes the main types. please contact us regarding other types. 2. dimensional gures supplied upon request. no. of contacts nominal dimensions part no. a b c d e f quantity per reel 8 300 mil (7.62mm) axs608109p 32.0 28.4 14.2 12.0 32.4 330 dia. 1,000 pcs. 28 450 mil (11.43mm) axs628129p 32.0 28.4 14.2 16.0 32.4 330 dia. 1,000 pcs. 32 525 mil (13.34mm) axs632139p 44.0 40.4 20.2 24.0 44.4 380 dia. 1,000 pcs. 44 600 mil (15.24mm) axs644149p 56.0 52.4 26.2 24.0 56.4 370 dia. 750 pcs. socket orientation with respect to direction of embossed tape progress type direction of tape progress all products socket axs6.fm 174 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
axs6 175 notes 1. as this construction stresses the pc board s contact ability, you should take the pc board thickness into account when studying creating a socket. the recommended pc board (made from fr-4) thickness is at least 1.0 mm for an sop ic socket. 2. re?w soldering in order to ensure solder strength, cream solder used should have a strength equivalent to sparkle solder paste 63- 101f (senju metal industry co., ltd.). 3. manual soldering the so packages (1) soldering iron and solder use a small capacity soldering iron with a narrow tip and thin wire solder. example) capacity: 100v ac 15w tip diameter: 1.0 to 1.2mm wire solder diameter: 0.6 to 0.8mm (2) soldering time perform soldering quickly. solder within 5 seconds using the soldering iron speci ed above. (3) soldering see 2. hand soldering on pages 8 and 9. 4. if the ic s pin pitch is uneven, it might not ? into the socket or the ic may become damaged. check the ic s pin pitch before insertion. 5. when setting the frame, please use one of our specialized tools, and make sure that all frame tabs are securely inserted. if setting an ic embedded in a frame on the main unit, press in the frame until both tabs are rmly snapped into the main unit. when the frame is full inserted, there will be an audible snapping sound. 6. when setting the frame by hand, lock all arms (24 contacts or less: 2 points, 28 and 32 contacts: 4 points, 40 and 42 contacts: 6 points) to the socket body at the same time. in case of 40, 44 contacts, there is a possibility that the frame is not rmly locked because of its swell in the middle. please press by nger into the marked direction shown in the following gure. 7. when removing the frame, use the special tool available from us designed for that purpose. when replacing an ic, be sure to use the special frame removal tool available from us. do not apply excessive displacement to the arms on the frame. doing so may result in damage. 8. do not bend the pins. doing so may result in damage. 9. do not pull the pins with excessive force. doing so may cause them to come off. regarding general notes, please refer to pages 8 and 9. 1 2 same time (good) (not good) axs6.fm 175 ?y?[?w ?q?o?o?r?n?p?q???q?q??@???j??@?????p?q???p?p?a
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